MOBILE: ULTRA-HIGH I/O WITHOUT TSV
ZiBond® & DBI®:Wafer Bonding and Interconnect for 2.5D/3DIC, Sensor
A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.
Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.
May 24, 2016 -
Invensas to Showcase 3D Packaging, Interconnect and Bonding Solutions at IEEE Electronic Components and Technology Conference
May 2, 2016 -
Invensas Signs BVA Technology License and Development Agreement with ASE
Multi-die face-down (xFD®) high-performance stacked DRAM
Bond Via Array (BVA®) Package-on-Package: Enabling technology for advanced mobile applications
May 31-June 3, 2016
The Cosmopolitan of Las Vegas,
Las Vegas, NV, USA
More events coming soon.