• Advanced interconnect technologies from Invensas

    Ultrabook:
    xFD® MEMORY

    LEARN MORE
  • ULTRA-HIGH I/O WITHOUT TSV

    MOBILE: ULTRA-HIGH I/O
    WITHOUT TSV

    LEARN MORE
  • Advanced interconnect technologies from Invensas

    ZiBond® & DBI®:
    Wafer Bonding and Interconnect for 2.5D/3DIC, Sensor

    LEARN MORE
  • Advanced interconnect technologies from Invensas

    INNOVATIVE INTERCONNECT
    SOLUTIONS

    LEARN MORE
Invensas

A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.

Technology

Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.

Multi-die face-down (xFD®) high-performance stacked DRAM

Bond Via Array (BVA®) Package-on-Package: Enabling technology for advanced mobile applications

Invensas Frost & Sullivan 2013 Award

Careers

MORE EVENTS