Invensas's mission is to enable tomorrow’s semiconductor technologies through inventive solutions today. We do this by inventing, productizing and acquiring intellectual property (IP).

INVENTING: Collaborative interdisciplinary teams of technologists create novel products and find solutions to critical industry roadmap problems, or “choke-points”.

PRODUCTIZING: Highly experienced engineers and Ph.D. technologists build and debug products on front-end and back-end semiconductor production lines to perfect and qualify products for market.

ACQUIRING: Skilled experts and industry veterans mine, analyze, acquire and aggregate patents into valuable portfolios to provide broader and more complete solutions for our customers.

 

In-House Capabilities

Front of Line and End of Line prototype manufacturing capability from TSV fabrication to complete board level assembly. A broad range of design and simulation capabilities from chip to system level, advanced characterization including 3D X-Ray and FE-SEM, and complete product reliability laboratories from silicon to board level. State of the art IP identification, evaluation and acquisition expertise including advanced analytics tools and systems. Advanced material science capabilities ranging from formulation and simulation to full characterization and product life cycle testing. 

	Front of Line and End of Line prototype manufacturing capability from TSV fabrication to complete board level assembly.
	A broad range of design and simulation capabilities from chip to system level, advanced characterization including 3D X-Ray and FE-SEM, and complete product reliability laboratories from silicon to board level.
	State of the art IP identification, evaluation and acquisition expertise including advanced analytics tools and systems.
	Advanced material science capabilities ranging from formulation and simulation to full characterization and product life cycle testing