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Upcoming Events
May 14-17, 2013 Toronto, Ontario, Canada - Keynote Address: Solder Assembly Solutions for 3D IC Packaging
May 20-23, 2013 Las Vegas, Nevada, USA - Bond Via Array™ – A New Ultra-fine Pitch Package on Package Solution for High Bandwidth Mobile Applications
May 28-31, 2013 Las Vegas, Nevada, USA June 4-8, 2013 Grand Hyatt Taipei, Taiwan - Invensas xFD™ Technology Exhibit
July 9-11, 2013 San Francisco, CA, USA - Invensas Interconnectology Exhibit
Previous Events & Publications
April 10-12, 2013 Osaka, Japan April 10-12, 2013 Beijing, China - Invensas xFD™ Technology Exhibit
Materials Research Society (MRS) April 1-5, 2013 San Francisco, CA, USA Semi-Therm 29
March 17-21, 2013 San Jose, CA, USA - PANEL: NSF Industry/University Cooperative Research Center for Energy Smart Electronic Systems
China Semiconductor Technology International Conference (CSTIC)
March 17-18, 2013 Shanghai, China IMAPS Device Packaging
March 12-14, 2013 Scottsdale, AZ, USA SensorsCon 2013
March 6, 2013 Santa Clara, CA, USA BiTS Workshop
March 4-6, 2013 Mesa, AZ, USA - Interconnectology: Inspiring a Paradigm Shift
- Bridging Between 3D Stacking and 3D IC Technologies (presentation) by Belgacem Haba
Most Inspirational Presentation Award
 Frederick Taber (BiTS Workshop General Chairman), Belgacem Haba (VP and Sr. Fellow, Invensas), Mike Noel (Freescale and BiTS Workshop's Technical Program Chair)
Photo courtesy of BiTS Workshop, LLC.
Printed Circuit Board Design & Fab
IPC APEX Expo
February 20, 2013 San Diego, CA, USA IMAPS Luncheon
February 6, 2013 Santa Clara, CA, USA Semiconductor Packaging News:
SPIE Electronic Imaging Symposium
February 5, 2013 Burlingame, CA, USA Chip Scale Review
January-February 2013 Issue (page 30) IEEE/CPMT Luncheon
January 24, 2013 Santa Clara, CA, USA SMTA Pan Pacific
January 23, 2013 Maui, HI, USA Sandia National Lab
January 22, 2013 Albuquerque, NM, USA 2013 International CES
January 8-11, 2013 Las Vegas, NV, USA - Invensas xFD Technology Demonstration
IEEE CPMT Symposium
December 10, 2013 Kyoto, Japan ECN Roundtable: Predictions for 2013
MEPTEC Known Good Die Symposium
November 15, 2012 Santa Clara, CA, USA IMAPS ATW: Thermal Management
November 12, 2012 Los Gatos, CA, USA SEMATECH: Underfill Challenges for 3D Interconnect
November 9, 2012 San Jose, CA, USA IWLPC
November 5-8, 2012 San Jose, CA, USA - TSV Process Variations for 2.5 and 3D Semiconductor Packaging (presentation) by Vern Solberg
- Design and Process Optimization for Competitive Through Silicon Via Interposers for 3D (paper) by Cyprian Uzoh, Rezwana Sharna, Pejman Monajemi, Michael Newman, Charles Woychik, and Terrence Caskey
- Design and Process Optimization for Competitive Through Silicon Via Interposers for 3D (presentation) by Cyprian Uzoh, Rezwana Sharna, Pejman Monajemi, Michael Newman, Charles Woychik, and Terrence Caskey
IPC International Conference on HDI
October 25, 2012 El Segundo, CA, USA SMTA International
October 17, 2012 Orlando, FL, USA - xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR SDRAM (paper) by Vern Solberg, Simon McElrea, and Wael Zohni
- xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR SDRAM (presentation) by Vern Solberg, Simon McElrea, and Wael Zohni
- 3D Packaging for High Computing With Wide I/O Processor-Memory Interface (paper) by Ilyas Mohammed, Ron Zhang and Rajesh Katkar
- 3D Packaging for High Computing With Wide I/O Processor-Memory Interface (presentation) by Ilyas Mohammed, Ron Zhang and Rajesh Katkar
- Development And Optimization Of Through Silicon Via Interposers (paper) by Pejman Monajemi, Michael Newman, Cyprian Uzoh, Charles Woychik, Lina Ayat, and Terrence Caskey
- Development And Optimization Of Through Silicon Via Interposers (presentation) by Pejman Monajemi, Michael Newman, Cyprian Uzoh, Charles Woychik, Lina Ayat, and Terrence Caskey
ISMP
October 10, 2012 Ilsan, Korea - DIMM IN A PACKAGE Technology for Ultrabook and Tablet Applications
MEMCON
September 18, 2012 Santa Clara, CA, USA
ESTC
September 17-20, 2012 Amsterdam, The Netherlands
IDF
September 11-13, 2012 San Francisco, CA, USA - Invensas Technology Exhibit
IMAPS
September 11-13, 2012 San Diego, CA, USA IMAPS Nordic
September 2-4, 2012 Helsingør, Denmark Semiconductor Manufacturing China (SEMI China)
SEMICON West: Impress Lounge @ B Bar
July 10-12, 2012
San Francisco, CA, USA
Chip Scale Review
July-August 2012 Issue (page 12) Electronic Components and Technology Conference (ECTC)
May 29 – June 1, 2012 San Diego, CA, USA - Fine Pitch Copper PoP for Mobile Applications (paper) by Philip Damberg, Ilyas Mohammed, Rey Co, Roseann Alatorre, Ellis Chau, Wei-Shun Wang
- Fine Pitch Copper PoP for Mobile Applications (presentation) by Philip Damberg, Ilyas Mohammed, Rey Co, Roseann Alatorre, Ellis Chau, Wei-Shun Wang
JISSO Technology Group Forum
May 9, 2012 Nuremberg, Germany International Conference on Electronics Packaging (ICEP)
April 20, 2012 Tokyo, Japan - A multi-die DRAM package for solder-down memory in UltraBook and Tablet PC applications (paper) by R. Crisp1, W. Zohni1, B. Haba2, G. Pelissier3, V. Bui3 (1Invensas Corp., San Jose, Ca. USA, 2Tessera Intellectual Property Corp., San Jose, Ca, USA, 3Dell Inc., Taipei, Taiwan)
- A multi-die DRAM package for solder-down memory in UltraBook and Tablet PC applications (presentation) by R. Crisp1, W. Zohni1, B. Haba2, G. Pelissier3, V. Bui3 (1Invensas Corp., San Jose, Ca. USA, 2Tessera Intellectual Property Corp., San Jose, Ca, USA, 3Dell Inc., Taipei, Taiwan)
South East Asia Technical Conference on Electronics Assembly Technologies (SMTA)
April 18, 2012 Penang, Malaysia Intel Developer Forum (IDF)
April 11-12, 2012 Beijing, China - Invensas xFDTM Technology Exhbibit
International Symposium on Quality Electronic Design (ISQED)
March 19-21, 2012 Santa Clara, CA USA IMAPS 8thInternational Conference and Exhibition on Device Packaging
March 6-8, 2012 Scottsdale, AZ USA Pan Pacific Microelectronics Symposium
February 14-16, 2012 Kauai, Hawaii USA MEPTEC
SMTA
ISMP
October 12-13, 2011 Seoul, Korea Semicon Europa
October 10-11, 2011 Messe Dresden, Germany Electronics Packaging Symposium
October 10-11, 2011 Binghamton, NY USA IMAPS
Oct 9-13, 2011 Long Beach, CA USA IWLPC
October 3-6, 2011 Santa Clara, CA USA ASQED
July 18-21, 2011 Kuala Lumpur, Malaysia Semicon West
July 13-15 2011 San Francisco, CA USA AIST
July 13, 2011 San Francisco, CA USA AIST
ECTC
May 31 – June 3, 2011 Lake Buena Vista, FL USA IPC APEX Expo
March 30, 2011 Las Vegas, NV USA |
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