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Solutions

Upcoming Events

September 9-11, 2014
San Francisco, CA, USA
  • Invensas Technology Exhibit
September 28 – October 2, 2014
Rosemont, IL, USA
  • September 29, 3:30pm: Evolving Technologies Panel: Covering Key Technologies Including: Embedded Actives/Passives, 3D/TSV, Printed Electronics, Advanced Packaging Trends, EMS Trends, and Lead-Free Status
  • September 30, 11am: Scalable 3D IC Assembly Methods
  • October 1, 8am: Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
October 8-9, 2014
Binghamton, NY, USA
  • Advanced Interconnectology for Next Generation Mobile Devices
October 14-16, 2014
San Diego, CA, USA
  • October 14, 10:45am: Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
  • October 15, 2:30pm: Assembly and Scaling Challenges for 2.5D IC
  • October 16, 2:45pm: High-brightness LEDs of Big Chip Size Packaged on Thru-Ceramic Via with Optimized Thermal Dissipation and Optical Performance
October 28-30, 2014
Raleigh, NC, USA

Previous Events & Publications

GSAM 2014
July 9-11, 2014
San Francisco, CA, USA
COMPUTEX TAIPEI
June 3-7, 2014
Taipei, Taiwan
  • Invensas Technology Exhibit, Grant Hyatt Hotel Room 1040
DAC 2014
June 1-5, 2014
San Francisco, CA, USA
ECTC 2014
May 27-30, 2014
Lake Buena Vista, FL, USA
MEPTEC MEMS Technology Symposium
May 22, 2014
San Jose, CA, USA
ECS: Electrochemical Society Spring Meeting
May 11-14, 2014
Orlando, FL, USA
COMPOTECHAsia
SEMICON Singapore
April 23-25, 2014
Marina Bay Sands Expo, Singapore
ICEP 2014
April 23-25, 2014
Toyama, Japan
MRS
April 21-25, 2014
San Francisco, CA, USA
IDF Shenzhen
April 2-3, 2014
Shenzhen, PRC
  • Invensas Technology Exhibit Booth #152 (see map)
Solid State Technology
Mar 27, 2014
Webcast
China Semiconductor Technology International Conference (CSTIC) 2014
March 17, 2014
Shanghai, China
IMAPs Device Packaging
March 11-12, 2014
Scottsdale/Fountain Hills, AZ, USA
BiTS (Burn-in & Test Strategies) Workshop
March 9-12, 2014
Mesa, AZ, USA
International CES
January 7-10, 2014
Las Vegas, NV, USA
  • Invensas Technology Exhibit
Japan Institute of Electronics Packaging (JIEP)
Vol. 6, No. 1 December 2013
3D ASIP
December 11-13, 2013
Burlingame, CA, USA
Chip Scale Review
November-December 2013 Issue
(page 40)
IEEE CPMT Symposium
November 11, 2013
Kyoto, Japan
IMAPS ATW: Thermal Management
November 7, 2013
Los Gatos, CA, USA
IWLPC
November 5-7, 2013
San Jose, CA, USA
EPEPS 2013
October 30, 2013
San Jose, CA, USA
IMPACT-IAAC 2013
October 23, 2013
Taipei, Taiwan
  • Panel: Designing Electronic Products for Sustainable Manufacture
IEEC Electronics Packaging Symposium
October 15, 2013
Binghamton, NY, USA
  • Challenges of Packaging Thin Si-Interposers having Through Silicon Vias (TSV)
SMTA International
October 14-16, 2013
Fort Worth, TX, USA
S3S Conference 2013: 3DI Short Course
EMAP 2013
October 7, 2013
Seoul, Korea
IMAPS 2013
September 29 - October 3, 2013
Orlando, Florida, USA
IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process
September 11, 2013
Chandler, AZ, USA
IDF 2013
September 10-12, 2013
San Francisco, CA, USA
  • Invensas xFD™ Exhibit
EMPC 2013
September 9-12, 2013
Grenoble, France
Frost & Sullivan Best Practices Award
September 11, 2013
San Jose, CA, USA

North American 3D Packaging and 3D IC for Mobile Computing Customer Value Enhancement Award

Award
Bel Haba (VP and Sr. Fellow, Invensas) and Rajiv Kumar (Senior Partner, Frost & Sullivan)

Photo courtesy of Frost & Sullivan
SEMICON Taiwan 2013
September 5, 2013
Taipei City, Taiwan (R.O.C.)
EDN Taiwan
Chip Scale Review
July-August 2013 Issue
(page 10)
ASME InterPACK2013
July 16-18, 2013
Burlingame, CA, USA
  • Panel 11-2 Packaging and Thermal Management Challenges for 3D Packages Including Silicon and Glass Interposers
SEMICON West 2013
July 9-11, 2013
San Francisco, CA, USA
  • Invensas Interconnectology Exhibit
COMPUTEX TAIPEI
June 4-8, 2013
Grand Hyatt Taipei, Taiwan
ECTC 2013
May 28-31, 2013
Las Vegas, Nevada, USA
IPC ESTC
May 20-23, 2013
Las Vegas, Nevada, USA
ICSR 2013
May 14-17, 2013
Toronto, Ontario, Canada
Future Fab International
Issue 45: April 25, 2013
ICEP 2013
April 10-12, 2013
Osaka, Japan
IDF Beijing
April 10-12, 2013
Beijing, China
  • Invensas xFD™ Technology Exhibit
Materials Research Society (MRS)
April 1-5, 2013
San Francisco, CA, USA
Semi-Therm 29
March 17-21, 2013
San Jose, CA, USA
  • PANEL: NSF Industry/University Cooperative Research Center for Energy Smart Electronic Systems
China Semiconductor Technology International Conference (CSTIC)
March 17-18, 2013
Shanghai, China
IMAPS Device Packaging
March 12-14, 2013
Scottsdale, AZ, USA
SensorsCon 2013
March 6, 2013
Santa Clara, CA, USA
BiTS Workshop
March 4-6, 2013
Mesa, AZ, USA

Most Inspirational Presentation Award

Award
Frederick Taber (BiTS Workshop General Chairman), Belgacem Haba (VP and Sr. Fellow, Invensas), Mike Noel (Freescale and BiTS Workshop's Technical Program Chair)

Photo courtesy of BiTS Workshop, LLC.
Printed Circuit Board Design & Fab
IPC APEX Expo
IMAPS Luncheon
February 6, 2013
Santa Clara, CA, USA
Semiconductor Packaging News:
SPIE Electronic Imaging Symposium
Chip Scale Review
January-February 2013 Issue (page 30)
IEEE/CPMT Luncheon
January 24, 2013
Santa Clara, CA, USA
SMTA Pan Pacific
Sandia National Lab
January 22, 2013
Albuquerque, NM, USA
2013 International CES
January 8-11, 2013
Las Vegas, NV, USA
  • Invensas xFD Technology Demonstration
IEEE CPMT Symposium
December 10, 2013
Kyoto, Japan
ECN Roundtable: Predictions for 2013
MEPTEC Known Good Die Symposium
November 15, 2012
Santa Clara, CA, USA
IMAPS ATW: Thermal Management
November 12, 2012
Los Gatos, CA, USA
SEMATECH: Underfill Challenges for 3D Interconnect
November 9, 2012
San Jose, CA, USA
IWLPC
November 5-8, 2012
San Jose, CA, USA
IPC International Conference on HDI
October 25, 2012
El Segundo, CA, USA
SMTA International
October 17, 2012
Orlando, FL, USA
ISMP
October 10, 2012
Ilsan, Korea
  • DIMM IN A PACKAGE Technology for Ultrabook and Tablet Applications

MEMCON
ESTC
September 17-20, 2012
Amsterdam, The Netherlands

IDF
September 11-13, 2012
San Francisco, CA, USA
  • Invensas Technology Exhibit

IMAPS

IMAPS Nordic

Semiconductor Manufacturing China (SEMI China)
SEMICON West: Impress Lounge @ B Bar
July 10-12, 2012
San Francisco, CA, USA


Chip Scale Review
July-August 2012 Issue (page 12)
Electronic Components and Technology Conference (ECTC)
May 29 – June 1, 2012
San Diego, CA, USA
JISSO Technology Group Forum
International Conference on Electronics Packaging (ICEP)
April 20, 2012
Tokyo, Japan
South East Asia Technical Conference on Electronics Assembly Technologies (SMTA)
April 18, 2012
Penang, Malaysia
Intel Developer Forum (IDF)
April 11-12, 2012
Beijing, China
  • Invensas xFDTM Technology Exhbibit
International Symposium on Quality Electronic Design (ISQED)
IMAPS 8thInternational Conference and Exhibition on Device Packaging
Pan Pacific Microelectronics Symposium
February 14-16, 2012
Kauai, Hawaii USA
MEPTEC
SMTA
October 19, 2011
ISMP
Semicon Europa
Electronics Packaging Symposium
October 10-11, 2011
Binghamton, NY USA
IMAPS
Oct 9-13, 2011
Long Beach, CA USA
IWLPC
October 3-6, 2011
Santa Clara, CA USA
ASQED
July 18-21, 2011
Kuala Lumpur, Malaysia
Semicon West
July 13-15 2011
San Francisco, CA USA
AIST
July 13, 2011
San Francisco, CA USA
AIST
July 2011
Tokyo, Japan  
ECTC
May 31 – June 3, 2011
Lake Buena Vista, FL USA
IPC APEX Expo
March 30, 2011
Las Vegas, NV USA
 
 
Revolutionary

Interconnectology refers to what we do from a technology perspective and from a value-chain perspective. It is a system-level approach to the design and development of next-generation interconnect devices.