Hermes Testing Solution Inc. and Invensas Corporation Enter Into Long-term Technology and Patent Licensing Agreement
April 16, 2013
Invensas Licenses xFDTM Technology, will be Demonstrated in UltrabooksTM at
CES 2013
January 07, 2013
Tessera and hynix Enter Into Eight-Year Patent Licensing Agreements
January 02, 2013
Invensas to Showcase xFD™ Technology Platforms and OEM Engagements at Intel Developer Forum
Aug 29, 2012
Invensas Unveils Groundbreaking Package-on-Package Solution for Next-Generation Smartphone and Tablet Computing
May 22, 2012
Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology
April 10, 2012
Invensas Purchases 73 MoSys Patents
December 29, 2011
Invensas Acquires ALLVIA 3D-IC Packaging Technology
November 01, 2011
New Invensas Multi-Die Face Down Packaging Technology Enables NANIUM to Produce High Density, High Speed DRAM Solutions
October 01, 2011
Invensas Corporation to Present at ISMP
October 05, 2011
Invensas Corporation to Present at SEMICON Europa
October 04, 2011
Invensas Panel and Presentation at IWLPC
September 28, 2011
Invensas Validates DFD-Based RDIMM Modules With Montage Chips
September 14, 2011