A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.

Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.

May 21, 2013 - Invensas Demos New High Bandwidth Packaging Solution for Mobile Devices at 2013 ECTC, Las Vegas

May 21, 2013 - Invensas Shows New xFD Customer Products, Including ASUS Ultrabooks, at Computex Taipei