2.5 & 3D: TSVINTERPOSER
MOBILE: ULTRA-HIGH I/O WITHOUT TSV
MOBILE: HIGH BANDWIDTH POP
A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.
Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.
October 03, 2013 - ADATA Technology to Provide Invensas Corporation's xFD Memory Modules to Server and Data Center Customers
Invensas Technology Exhibit & Presentations
IMAPS ATW: Thermal Management
November 7, 2013Los Gatos, CA, USA
Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation
IEEE CPMT Symposium
November 11, 2013
Bridging Between 3D Stacking and 3D IC Technologies
Invensas Technology Exhibit
May 27-30, 2014
Lake Buena Vista, FL, USA