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Why Invensas?
Invensas's design capabilities
extend from chip-level to
board module and system-level.
Our technology encompasses: |
- High speed performance
in multi DRAM packaging
- Dual Face Down
architecture for multi-die DRAM
- 3D-IC technology
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News
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April 10, 2012 - Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution
Based on xFD Technology
December 29, 2011 - Invensas Purchases 73 MoSys Patents
November 01, 2011 - Invensas
Acquires ALLVIA 3D-IC Packaging Technology
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Events
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May 09, 2012
JISSO | Nuremberg, Germany
Very Low Profile Multiple Die
Package Innovation for High Performance DDR3 and DDR4 SDRAM
May 29 - Jun 01, 2012
ECTC | San Diego, CA, USA
Fine Pitch Copper PoP for Mobile Applications
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Invensas is Hiring!
Join a World
Class team of Inventors,
Innovators and IP Pioneers |
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