Invensas

A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.

Technology

Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.

Multi-die face-down (xFD™) high-performance stacked DRAM

Bond Via Array (BVA™) Package-on-Package: Enabling technology for advanced mobile applications

Mobile: This changes everything

Invensas Frost & Sullivan 2013 Award

Careers

MORE EVENTS