2.5 & 3D: TSVINTERPOSER
MOBILE: ULTRA-HIGH I/O WITHOUT TSV
MOBILE: HIGH BANDWIDTH POP
INNOVATIVE LED PACKAGING FOR HB LEDs
BREAKTHROUGH MEMS AF TECHNOLOGY
A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.
Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.
June 04, 2014 - Invensas to Showcase xFD Technology Platforms During COMPUTEX 2014
May 27, 2014 - Invensas to Demo Latest Innovations in Mobility, LED and 3D-ICs at ECTC 2014
Multi-die face-down (xFD™) high-performance stacked DRAM
Bond Via Array (BVA™) Package-on-Package: Enabling technology for advanced mobile applications
Mobile: This changes everything
July 9-11, 2014
San Francisco, CA, USA
Scalable Three-Dimensional Chip Stacking Using Cu TSVs
MEPTEC MEMS Technology Symposium
May 22, 2014San Jose, CA, USA
MEMS-based Autofocus in Cameras
May 27-30, 2014
Lake Buena Vista, FL, USA
June 1-5, 2014San Francisco, CA, USA
Open3D Panel: Design for 3D: Are Standards Leading the Way or Lagging Behind?
June 3-7, 2014
Invensas Technology Exhibit, Grant Hyatt Hotel Room 1040