Moving Beyond Moore's Law
3D SEMICONDUCTOR
SOLUTIONS
We enable Highest Bandwidth, Thinnest, Smallest Footprint and Lowest Cost-of-Ownership 3DIC Solutions.
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3D INTEGRATION
TECHNOLOGIES
We develop and license innovative 3D integration semiconductor technologies.
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MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
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SEMICONDUCTOR
PACKAGING
We develop and license innovative chip-scale packaging and interconnect technologies.
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3D INTERCONNECT
SOLUTIONS
Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
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MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
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CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com
Invensas Sales & Licensing
invensas@xperi.com
CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com
Invensas Sales & Licensing
sales@invensas.com
