NEXT GENERATION SEMICONDUCTOR PACKAGING
AND INTERCONNECT TECHNOLOGY
SEMICONDUCTOR
PACKAGING
We develop and license innovative chip-scale packaging and interconnect technologies.
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3D INTERCONNECT
SOLUTIONS
Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
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MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More
SEMICONDUCTOR
PACKAGING
We develop and license innovative chip-scale packaging and interconnect technologies.
Learn More
3D INTERCONNECT
SOLUTIONS
Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
Learn More
MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More
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CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com
Invensas Sales & Licensing
invensas@xperi.com
CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com
Invensas Sales & Licensing
sales@invensas.com
