Moving Beyond Moore's Law
3D SEMICONDUCTOR
SOLUTIONS
We enable Highest Bandwidth, Thinnest, Smallest Footprint and Lowest Cost-of-Ownership 3DIC Solutions.
Learn More
3D INTEGRATION
TECHNOLOGIES
We develop and license innovative 3D integration semiconductor technologies.
Learn More
MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More
SEMICONDUCTOR
PACKAGING
We develop and license innovative chip-scale packaging and interconnect technologies.
Learn More
3D INTERCONNECT
SOLUTIONS
Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
Learn More
MARKETS SERVED
You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More
EXPLORE POSSIBILITIES
MARKETS
SOLUTIONS
TECHNOLOGIES
BRAND NEWS
[list_news]
INVESTOR NEWS
[list_investor]
CONTACT US
If you have not found the information you came for, we are just a click away.
CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
[email protected]
Invensas Sales & Licensing
[email protected]
CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
[email protected]
Invensas Sales & Licensing
[email protected]
