NEXT GENERATION SEMICONDUCTOR PACKAGING
AND INTERCONNECT TECHNOLOGY

SEMICONDUCTOR
PACKAGING

We develop and license innovative chip-scale packaging and interconnect technologies.
Learn More

3D INTERCONNECT
SOLUTIONS

Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
Learn More

MARKETS SERVED

You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More

SEMICONDUCTOR
PACKAGING

We develop and license innovative chip-scale packaging and interconnect technologies.
Learn More

3D INTERCONNECT
SOLUTIONS

Finest Pitch, Thinnest, Smallest Footprint and
Lowest Cost-of-Ownership.
Learn More

MARKETS SERVED

You will find our technologies and solutions embedded in billions of devices and all the electronic devices you depend on in your world.
Learn More

EXPLORE POSSIBILITIES

MARKETS

SOLUTIONS

TECHNOLOGIES

BRAND NEWS

[list_news]

INVESTOR NEWS

[list_investor]

CONTACT US

CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com

Invensas Sales & Licensing
invensas@xperi.com

CORPORATE HEADQUARTERS
3025 Orchard Parkway
San Jose, CA 95134
+1 408.321.6000
Fx +1 408.321.8257
info@xperi.com

Invensas Sales & Licensing
sales@invensas.com

WordPress Image Lightbox Plugin