Welcome to IMS 2018!

Booth 313

June 12 – 14, 2018

Pennsylvania Convention Center (map)

Visit the Invensas booth where we will showcase Low Temperature Wafer Bonding and 3D Interconnect Technologies for RF Devices.

Tuesday, June 12: 9:30am – 5:00pm
Wednesday, June 13: 9:30am – 6:00pm
Thursday, June 14: 9:30am – 3:00pm


Schedule a Meeting