Videos

Used in over 1 Billion devices, ZiBond and DBI offer fast and cost effective bonding.

As smartphones get smarter and complete more tasks, how will semiconductor chips change to lower power consumption, but maintain performance and efficiency? Abul Nuruzzaman, Senior Director of Product Marketing at Invensas (part of Xperi), gave his two cents on the future of semiconductors, explaining the way they'll empower cars to see and save lives.

What is 3D semiconductor packaging and how will it shape the electronics industry? With decades of experience and proven leadership in semiconductor packaging and interconnect, Xperi delivers 3D integrated solutions that enhance performance, reduce power consumption and lower cost, allowing the industry to scale beyond Moore’s Law for a new generation of electronics products.

Capturing many of life's extraordinary experiences are made possible by the bonding technology that we created. From first steps to long walks on the beach, Invensas ZiBond and DiBond power the technology that surrounds us.

See how Invensas' Bond Via Array (BVA™) Package-on-Package (PoP) packaging solution maximizes bandwidth for mobile phones and tablets to meet emerging consumer demands for high performance applications like 3D video and gaming. This video showcases side by side comparisons of BVA performance to conventional PoP to demonstrate the advantages of increased bandwidth.

Watch how fast bond energy propagates and bonding took place using ZiBond technology for MEMS encapsulation

Watch Invensas' xFD™ performance compared side-by-side to conventional packaging technology. This video showcases the company's proven multi-die DRAM package technology and highlights its performance, temperature and cost advantages.

See how conventional film-assisted molding is used to manufacture Invensas' Bond Via Array® (BVA®) components.