Bond Via Array (BVA®) Package-on-Package (Short): Enabling technology for advanced mobile applications
See how Invensas' Bond Via Array (BVA™) Package-on-Package (PoP) packaging solution maximizes bandwidth for mobile phones and tablets to meet emerging consumer demands for high performance applications like 3D video and gaming. This video showcases side by side comparisons of BVA performance to conventional PoP to demonstrate the advantages of increased bandwidth.
