xFD

  • Multi-die face-down (xFD®) high-performance stacked DRAM
    Multi-die face-down (xFD®) high-performance stacked DRAM
    Watch Invensas' xFD® performance compared side-by-side to conventional packaging technology. This video showcases the company's proven multi-die DRAM package technology and highlights its performance, temperature and cost advantages.
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